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product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays . 1/ 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 tsz22111 ? 1 4 ? 001 www.rohm.com 6v to 20 v, 1a 1ch pwm buck converter integrated fet bd 9227f general description the bd 9227 f is a 20 v, 1a non-synchronous pwm duty control buck converter with integrated internal high-side 20 v power mosfet. operating frequency is 1.0mhz fixed by inner circuit. current mode control with internal slope compensation simplifies the external compensation calculation and reduces component count while allowing the use of ceramic output capacitors. additional protection features are included such as over current protection, thermal shutdown and u nder voltage lockout. the under voltage lockout and hysteresis can be set by external resistor. the bd9227f is available in sop8. features wide operating input range 6v to 2 0 v 2 0 v/ 20 0m internal power mosfet 1. 0 m hz fixed operating frequency current mode over current h iccup p eriod protection u nder voltage locked out(uvlo), over voltage protection(ovp), thermal shut d own(tsd) available in sop8 p ackage . k ey specification s ? input voltage range: 6 v to 20 v ? ref. precision: pwm=h: 2.0 %(1.0 %@ta= 25 c) ? max output current: 1 a (max.) ? switching frequency: 1. 0m hz (typ.) ? operating temperature range: -40 to +85c packages w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm applications ? home appliance ? vm motor typical application circuits fig ure 1 . typical application circuit sop8 datashee t non pwm fb comp bd9227f vb vcc lx gnd vcc pwm c vcc : 10uf c vb : 0.1uf c non: 1uf vout d1 l1:10uh cout: 10uf r1: 110k r2: 10k c2: 1.5nf r3: 33k
2 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f pin con f ig uration pin descriptio n pin no. pin name function 1 v b inner v oltage r egulator output p ower supply 2 v cc power supply 3 lx switch pin of pwm buck 4 gnd ground 5 comp compensation node 6 fb feedback signal 7 pwm pwm input signal 8 non inner dc ref voltage block diagra m fig ure 2 . pin configuration (top view) fig ure 3 . block diagram v o u t p w m v c c l x g n d c o m p n o n v b v c c 1 v m a x l v s v c c - 5 v o s c i l l a t o r 1 m h z v b c u r r e n t s e n s e a m p f e t v r e f u v l o t s d s h u t d o w n 3 v v c c 3 v f b e r r o r a m p i c o m p l o g i c n o n p w m f b c o m p 1 2 3 4 8 7 6 5 v b v c c l x g n d b d 9 2 2 7 f
3 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f description of block s 1. vref this b lock generates reference v oltage and current . it start s operation when vcc rise up . it provides reference voltage and current to e rror amp , o sc i l lator , and etc. 2. vb this is a gate d rive v oltage g enerator and vcc - 5. 0 v regulator for internal c ircuit voltage . 3. oscillator this is a precise wave o scillation c ircuit with o peration f requency fixed to 1. 0 mhz. 4 . e rror amp this is an e rror amplifier wh ich detects o utput s ignal, and outputs pwm c ontrol s ignal. internal reference v oltage is set by pwm input signal . also, the bd 9227 f have c urrent mode control with internal slope compensation simplifies the external co m pensation calculation and reduces component count while allowing the use of ceramic output capacitors. 5 . icomp this is a comparator that outputs pwm signal from current feed - back signal and error - amp output for c urrent - mode. 6 . p ch fet sw this is a 2 0 v/ 200 p power p ch mosfet sw that converts inductor c urrent of dc/dc c o n verter. 7 . uvlo this is a l ow v oltage e rror p revention c ircuit. this prevents internal circuit error during increase of p ower supply v oltage and during decline of p ower supply v oltage. it monitors vcc p in v oltage and internal reg v oltage, and when vcc v oltage becomes 5 . 3 v and below, it turns off all o utput fet and dc / dc c o nverter ?vrxwsxwdqg6riw6wduw c ircuit resets. now this t hreshold has h ysteresis of 200mv (typ) . 8 . tsd the current of power mosfet is limited by this function. when it detects an abnormal temperature exceeding tj=175 c , it turns off dc/dc c onverter output. the threshold of tsd has hysteresis (25 c ). if temperature falls below 150 c , the ic automatically returns. 9 . ovp over voltage protection. output voltage is monitored with fb terminal, and output fet is turned off when it becomes vnon+ 200mv . 10. ocp this is a circuit to protect the high - side fet from over - current. every cycle the switch current and the reference voltage of over - current protection are compared; when the peak inductor current continuously intersects the reference voltage, the high - side switch is turned off. once 2 times continuous over current is detected, the device will stop and comp/ non pin voltage will be reset( to gnd) and after 8.191ms the device restart . (ref er to p age .7 figure 5) 11. pwm the pwm pin is the input pin to control active or inactive of the bd9227f and the pwm input pulse determines the output voltage (refer to page. 15 (3) output voltage setting ) . once the pulse is input on the pwm pin, the internal enable signal turns on then the internal regulator turns on . after the each regulator operates , the bd9227f start s switching. when the low period of the pwm pulse is longer than 2.047msec (typ), the bd9227f stop s opera tion (refer to page.7 figure 4 ) .
4 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f absolute maximum ratings (ta=2 5 c ) parameter symbol rating unit vcc to gnd v cc - 0.3 to + 2 2 v v b to gnd v b - 0.3 to + 2 2 v lx to gnd v lx - 2.0 to + 22 v vcc to lx ? v lx - 0.3 to + 22 v vcc to v b ? v b - 0.3 to + 7 v comp to gnd v comp - 0.3 to + 7 v non to gnd v non - 0.3 to + 7 v fb to gnd v fb - 0.3 to + 7 v pwm to gnd v pwm - 0.3 to + 7 v high - s ide fet drain current i dh ocp a power dissipation pd 0. 633 (note 1) w operating temperature topr - 40 to + 8 5 c storage temperature t stg - 55 to +150 c junction temperature tjmax 150 c (note 1) during mounting of 114.3 7 6.2 1. 57 t mm 1 layer board.reduce by 5.07 mw for every 1 increase. (above 25 ) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider ci rcuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s ( note 3 ) 2s2p ( note 4) sop8 junction to ambient j a 197.4 109.8 c /w junction to top characterization parameter ( note 2 ) jt 21 19 c /w (note 1) based on jesd51 - 2a(still - air) (note 2) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (note3) using a pcb board based on jesd51 - 3 layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and t races 70 m (note 4) using a pcb board based on jesd 51 - 7 layer number of measurement board material board size thermal via (n ote 5) pitch diameter 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt 1.20mm - 0.30mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 5 ) this thermal via connects with the copper pattern of all layers
5 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f recommended operating conditions parameter symbol min typ max unit input voltage v cc 6 - 2 0 v output voltage v out (note1) vcc x 0.252 - vcc v output current i out - - 1 a non i nput v oltage v non - - 1 v pwm i nput v oltage v pwm - - 5.5 v pwm i nput f requency f pwm 1 - 50 khz input capacitor c vcc (note 2 ) 4.7 10 - f inner regulator capacitor c vb (note 3 ) 0. 047 0.1 0.22 f inductor l (note 4 ) 4.7 10 - h o utput capacitor c out (note 5 ) 4.7 10 - f ref voltage capacitor c non (note 6 ) - 1 - f pl ease select each capacitor considering the effect of dc bias and temperature coefficient to satisfy the specification. (note1) refer to p.18(10) (note2) refer to p.15 (6) (note 3 ) refer to p.1 5 ( 4 ) (note 4 ) refer to p.14 (1) (note 5 ) refer to p.1 5 ( 2 ) (note 6 ) refer to p.1 6 (7)
6 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f electrical characteristic s (unless otherwise specified ta=25 , vcc= 1 6 .0 v, vout= 1 2 .0 v, pwm= h ) parameter symbol min typ max unit c o nditions circuit current operating n on - s witching s upply c urrent i cc - 0. 4 1.0 ma pwm=h, fb = 3 v (non - switching) standby quiescent c urrent i st - 0. 05 0. 2 ma pwm=l under v oltage l ockout detect t hreshold v oltage v uv 5.0 5. 3 5. 6 v vcc falling hysteresis w idth v uvhy - 200 400 mv oscillator oscillating f requency f sw 0.8 0 1. 0 0 1. 2 0 m hz error a mplifier fb p in reference voltage v fb n 0. 9 90 1 .000 1.0 10 v pwm=h, ta=25 c v fb a 0.9 80 1 .000 1.02 0 v pwm=h, t a = - 40 to + 8 5 c fb pin bias current i fb - 1.0 0 1.0 a vfb = 0 v non i nner r r non 100 250 400 k icomp s ink c urrent ivc si 7.5 15 30 a comp =1v, non=1v, fb=2v icomp s ource c urrent ivc so - 30 - 1 5 - 7.5 a comp =1v, non=1v, fb= 0 v error a mplifier transconductance g m 5 0 115 1 8 0 a/v i comp = 3 a, non=1v, comp =1v switch c urrent to comp t ransconductance g cs - 2.2 5 a/v vcc=16v hig h - s ide mosfet on r esistance r onh - 20 0 - m vb c lamp v oltage v b vcc - 5.5 vcc - 5 vcc - 4.5 v over c urrent d etect c urrent i ocp 1 .6 2 .6 4.2 a pwm pwm l ogic high l evel v pwmh 1. 5 - 5.5 v pwm l ogic low l evel v pwml - - 0.5 v pwm internal p ull - d own resistor r pwm 200 500 800 n
7 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f timing c hart fig ure 4 . startup/ shutdown timing chart fig ure 5 . ocp timing chart v c c n o n p w m p w m _ c n t _ i h ( i n n e r ) v b v b u v l o _ i l ( i n n e r ) v c c l x v o u t ( f b ) c o m p o v p o u t _ i h ( i n n e r ) p w m o n _ i h ( i n n e r ) v c c u v l o r e s e t v b u v l o r e s e t v c c - 5 v t s s o v p o v p r e s e t v b u v l o s h u t d o w n d e l a y 2 . 0 4 7 m s e c r e g ( i n n e r ) r e g u v l o r e s e t r e g u v l o _ i l ( i n n e r ) r e g u v l o v o u t ( f b ) l x c o m p v o u t s h o r t t o g n d i l o c p t h o c p o u t _ i h ( i n n e r ) o c p _ l a t c h ( i n n e r ) o c p d e t e c t o c p l a t c h i s s e t h i c c u p t i m e : 8 . 1 9 1 m s e c ( t y p ) n o n r e s t a r t s h o r t c o n d i t i o n i s r e s e t r e s e t r e s t a r t
8 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f t ypical performance characteristics (unless otherwise specified, ta=25 c , v cc = 16 v, v out = 12 v, pwm =3v) fig ure 6 . f requency - temperature fig ure 7 . fb threshold voltage input voltage fig ure 8 . fb threshold voltage - temperature fig ure 9 . pwm pin inner reg on threshold - temperature 0.990 0.995 1.000 1.005 1.010 -40 -20 0 25 50 85 temperature[ 0.50 0.70 0.90 1.10 1.30 1.50 -40 -20 0 25 50 85 temperature[ 0.90 0.95 1.00 1.05 1.10 -40 -20 0 25 50 85 temperature[] 0.990 0.995 1.000 1.005 1.010 6 8 10 12 14 16 18 20 input voltage:v cc [v] fb threshold:v fb [v]
9 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f fig ure 10 . frequency input voltage fig ure 12 . ocp detect current - temperature fig ure 1 1 . p mos on resistance - temperature fig ure 1 3 . operating current temperature 0.900 0.950 1.000 1.050 1.100 6 8 10 12 14 16 18 20 input voltage:v cc [v] frequency:f sw [mhz] 200 300 400 500 -40 -20 0 25 50 85 temperature[ [a] 0 1 2 3 4 5 -40 -20 0 25 50 85 temperature[ 0.12 0.16 0.20 0.24 0.28 -40 -20 0 25 50 85 temperature[ []
10 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f fig ure 1 4 . operating current input voltage 200 300 400 500 6 8 10 12 14 16 18 20 input voltage: v cc [v] input current:i cc >$@ ta=-40
11 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f reference characteristics of t ypical application circuits (v out =12v) parts l1 >8 coilcraft lps5030 - 103ml 10 + c vcc /c out >8 murat a grm31cr71e106ma12# 10 ) / 25 v c vb >8 murata grm155r71e104me14# )9 d1 >8 rohm rb060m m - 3 0 fig ure 15 . typical application circuit (v out =12v) fig ure 16 . efficiency - output current (vout= 12 v) vcc=16v vcc=20v 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 output current:i out [ma] (iilflhqf\>@ n o n p w m f b c o m p b d 9 2 2 7 f v b v c c l x g n d v c c p w m c v c c : 1 0 u f c v b : 0 . 1 u f c n o n : 1 u f v o u t d 1 l 1 : 1 0 u h c o u t : 1 0 u f r 1 : 1 1 0 k r 2 : 1 0 k c 3 : o p e n c 2 : 1 . 5 n f r 3 : 3 3 k
12 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f fig ure 17 . start - up characteristics (v cc =16v, i out =0ma, v out =12v) fig ure 1 8 . start - up characteristics (v cc =1 6 v, i out = 1 a, v out =12v) fig ure 19 . shut - down characteristics (v cc = 16 v, i out =0ma, v out =12v) fig ure 2 0 . shut - down characteristics (v cc = 16 v, i out = 1 a, v out =12v) lx: 10v/div vout: 5v/div ilx: 1a/div pwm: 10v/div lx: 10v/div pwm: 10v/div vout: 5v/div ilx: 1a/div pwm: 10v/div lx: 10v/div vout: 5v/div ilx: 1a/div lx: 10v/div pwm: 10v/div vout: 5v/div ilx: 1a/div 200ms/div 200ms/div 1 s/div 400u s/div
13 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f fig ure 2 1 . vout ripple ( v cc =16v, i out = 1 0ma; v out =12v) fig ure 2 2 . vout ripple ( v cc =16v, i out = 1 a, v out =12v) fig ure 2 3 . frequency response ( v cc =16v, i out =1 00 ma, v out =12v) fig ure 2 4 . frequency response ( v cc =16v, i out = 1 a, v out =12v) vout(ac): 20mv/div vout(ac): 20mv/div phase gain bw= 33.11 khz pm= 81.64 deg phase gain bw= 38.90 khz pm= 81.20 deg iout: 10ma/div iout: 1a/div 1 s/div 1 s/div
14 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f selection of components externally connected (1) inductors something of the shield type that fulfills the current rating (current value ipeak below), with low dcr is recommended. value of inductance influences inductor ripple current and becomes the cause of output ripple. in the same way as the formula below, this ripple current can be made small for as big as the l value of coil or as high as the switching frequency. (1) (2) ( a il: output ripple current, vcc: input voltage, vout: output voltage, f: switching frequency) for design value of inductor ripple current, please carry out design tentatively with about 20% : 50% of maximum input current. in the bd9227f , it is r ecomm ended the inductance value more than 4.7uh . recommended inductor coilcraft lps5030 series when current that exceeds coil rating flows to the coil, the coil causes a magnetic saturation, and there are cases wherein a decline in efficiency, oscillation of output happens. please have sufficient margin and select so that peak current does not exceed rating current of coil. fig ure 2 6 . inductor current fig ure 2 5 . load response ( v cc =16v, v out =12v, i out = 100ma o 1 a) vout: 0.5v/div iout: 0.5 a/div undershoot: 0. 79 v over shoot: 0.83 v 4m s/div ? i l f 1 vcc vout l1 vout vcc il ? ? ? ? 2 il iout ipeak ? ? ?
15 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f (2) output capacitor in order for c apacitor to be used in o utput to reduce o utput r ipple, low ceramic capacitor of esr is recommended . also, for c apacitor r ating, on top of putting into consideration dc bias c haracteristics, please use something whose m aximum r ating has sufficient margin with respect to the output voltage. output r ipple v oltage is looked for using the following formula. the actual value of the output capacitor is not critical, but some practical limits do exist. consider the relationship between the crossover frequency of the design and lc corner frequency of the output filter. in general, it is desirab le to keep the crossover frequency at less than 1/ 2 0 of the switching frequency. with high switching frequencies such as the 1. 0 m hz frequency of this design, internal circuit limitations of the bd9227f limit the practical maximum crossover frequency to abo ut 5 0 khz. in general, the crossover frequency should be higher than the corner frequency determined by the load impedance and the output capacitor. this limits the minimum capacitor value for the output filter to: (3) where: rl is the output load resistance and fc_max is the maximum crossover frequency. the output ripple voltage can be estimated by: (4) please design in a way that it is held within capacity ripple voltage. in the bd9227f , it is recommended a ceramic capacitor more than 4.7 ) (3) output voltage setting error amp internal standard voltage is 1 v , vnon=1v x pwm duty . output voltage is determined by (5) ( pwm duty : th e duty of the waveform inputted into pwm terminal) (4) vb capacitor please connect from 0. 047 f ~0.22uf (laminate ceramic capacitor) between vcc pin and vb pin. ( caution: do q? t connect capacitor between vb pin to gnd pin that cause destroy the chip) ( 5 ) catch diode the bd9227f is designed to operate using an external catch diode between lx and gnd. the selected diode must meet the absolute maximum ratings for the application: reverse voltage must be higher than the maximum voltage at the lx pin, which is vccmax + 0.5 v. peak cu rrent must be greater than ioutmax + ? il plus on half the peak to peak inductor current. forward voltage drop should be small for higher efficiencies. it is important to note that the catch diode conduction time is typically longer than the high - side fet on time, so attention paid to diode parameters can make a marked improvement in overall efficiency. additionally, check that the device chosen is capable of dissipating the power losses. it ? s recommanded to use schottky barrier diode with the bd9227f . ( 6 ) input capacitor the bd9227f requires an input capacitor for decoupling and depending on the application. use low esr capacitors for the best performance. ceramic capacitors are preferred, but low - esr electrolytic capacitors may also suffice. please place t his capacitor as possible as close to the vcc pin. in the bd9227f , it is recommended a ceramic capacitor more than 4.7 ) when using ceramic capacitors, make sure that they have enough capacitance to provide sufficient charge to prevent excessive voltage ripple at input. the input voltage ripple caused by capacitance can be estimated by: (6) since the input capacitor (cvcc) absorbs the input switching current it requires an adequate ripple current rating. the rms current in the input capacitor can be estimated by: (7) the worst case condition occurs at vcc = 2vout, where (8) fig ure 2 7 . output voltage setting duty pwm * r2 r2 r1 vout ? ? ? ? ? ? ? ? ? ? ? ? vcc vout 1 vcc vout iout i cvcc v n o n ( 1 v * p w m d u t y ) v o u t e r r o r a m p r 1 r 2 f b fc_max rl 2 1 cout_min ? ? ? ? 2 iout i cvcc_max ? esr r il cout f 2 1 il vpp ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? vcc vout 1 vcc vout cvcc f iout vcc
16 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f ( 7 ) recommended cnon ( vs pwm frequency ) setting the pwm signal control on/off of bd9227f (pwm>1. 5 v on, pwm< 0.5v off) , and pwm duty determine the non value , in order to get proper non ripple value, according pwm frequency to se lect proper cnon capacitor . below is the relationship of pwm frequency, cnon and non ripple: non ripple=d* (1 - d)/(r*cnon* pwm frequency ) . (9) w hen d=0.5, non ripple=non ripple(max) non ripple(max)= 0.25 /( r*c non *pwm frequency) (10) d: pwm duty; r: inner 250k ? resistor non ripple=1mv condition non value=1v*pwm duty ( 8 ) recommended tss selection vs cnon bd9227f softstart time tss is determined by non rising speed, tss have relation with cnon. below is the relationship of tss and cnon tss=4.61*r*cnon (11) non reach 99% of target non value r: inner 250k ? resistor fi gure 29 . re commended cnon vs tss fig ure 2 8 . recommended pwm frequency vs c non 10 100 1000 1 10 100 pwm frequency[khz] cnon[nf] 10 100 1000 10000 10 100 1000 cnon[nf] tss[ms]
17 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f ( 9 ) about adjustment of dc/dc comparator frequency characteristics role of phase compensation element c 2 , c 3 , r3 (see p. 1 1 figure15. example of reference application circuit) stability and responsiveness of loop are controlled through comp pin which is the output of error amp. the combination of zero and pole that determines stability and responsiveness is adjusted by the combination of resistor and capacitor that are connected in series to the comp pin. dc gain of voltage return loop can be calculated for using the following formula. (12) here, vfb is feedback voltage (1.0v *pwm duty ).a ea is voltage gain of error amplifier (typ : 66.8 db), g cs is the trans - conductance of current detect (typ : 2.2 a/v), and rl is the output load resistance value. there are 2 important poles in the control loop of this dc/dc. the first occurs with/ through the output resistance of phase compensation capacitor (c 3 ) and error amplifier. the other one occurs with/through the output capacitor and load resistor. these poles appear in the frequency written below. (13) (14) here, g ea is the trans - conductance of error amplifier (typ : 11 5 ua/v). here, in this control loop, one zero becomes important. with the zero which occurs because of phase compensation capacitor c 2 and phase compensation resistor r3, the frequency below appears. (15) also, if output capacitor is big, and that esr (resr) is big, in this control loop, there are cases when it has an important, separate zero (esr zero). this esr zero occurs due to esr of output capacitor and capacitance, and exists in the frequency below. (16) (esr zero) in this case, the 3 rd pole determined with the 2 nd phase compensation capacitor (c 3 ) and phase correction resistor (r3) is used in order to correct the esr zero results in loop gain. this pole exists in the frequency shown below. (17) (pole that corrects esr zero) the target of phase compensation design is to cr eate a communication function in order to acquire necessary band width and phase margin. cross - over frequency (band width dwzklfk/rrsjdlqri5hwxuq/rrsehfrphv3lvlpsruwdqw when cross - over frequency becomes low, power supply fluctuation response, load response, etc worsens. on the other hand, when cross - over frequency is too high, instability of the loop can occur. tentatively, cross - over frequency is targeted to be made 1/20 or below of switching frequency. selection method of phase compensation constant is shown below. 1. phase compensation resistor (r3) is selected in order to set to the desired cross - over frequency. calculation of rc is done using the formula below. (18) here, fc is the desired cross - over frequency. i t is made about 1/20 and below of the switching frequency ( f sw ). 2. phase compensation capacitor (c 2 ) is selected in order to achieve the desired phase margin. in an application that has a representative inductance value ( more than 4.7 uh ) , by matching zero of compensation to 1/4 and below of the cross - over frequency, sufficient phase margin can be acquired.c 2 can be calculated using the following formula. (19) 3 2 2 1 1 r c fz ? ? ? ? ? rl cout fp ? ? ? ? ? 2 1 2 resr cout fz esr ? ? ? ? ? 2 1 3 3 2 1 3 r c fp ? ? ? ? ? ea ea a c g fp ? ? ? ? 2 2 1 ? fc r c ? ? ? ? 3 2 4 2 ? vfb vout g g fc cout r cs ea ? ? ? ? ? ? ? 2 3 vout vfb a gcs rl dc ea ? ? ? ? a
18 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f 3. examination whether the second phase compensation capacitor c 3 is necessary or not is done. if the esr zero of output capacitor exists in a place that is smaller than half of the switching frequency, a second phase compensation capacitor is necessary. in other words, it is the case wherein th e formula below happens. (20) in this case, add the second phase compensation capacitor c3, and match the frequency of the third pole to the frequency fp3 of esr zero. c3 is looked for using the following formula : (21) (10) about pwm duty adjustable range of bd9227f bd9227f vout voltage is determined by lx duty, but bd9227f ton - min limited duty range . the ton - min (max) = 21 0 ns, tperiod(min)=833ns, then the duty worst= 21 0/833= 25 .2 %, then the 25.2 %< vout/vcc <100 %. fig ure 3 0 . vout vs vcc available range available a rea unavailable a rea 3 3 r resr cout c ? ? 2 2 1 sw f resr cout ? ? ? ? ? 0 2 4 6 8 10 12 14 16 18 20 6 8 10 12 14 16 18 20 input voltage:v cc [v] vout:v out [v]
19 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f cautions on pcb board layout layout is a critical portion of good power supply design. there are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. to help eliminate these problems, the vcc pin should be bypassed to ground with a low esr ceramic bypass capacitor with b dielectric. care should be taken to minimize the loop area formed by the bypass capacitor connections, the vcc pin, and the anode of the catch diode. see fig ure 3 1 for a pcb layout example. in the bd9 22 7 f , since the lx connection is the switching node, the catch diode and output in ductor should be located close to the lx pins, and the area of the pcb conductor minimized to prevent excessive capacitive coupling. and gnd area should be connected directly to power gnd for avoid ing the external connect which cause s the different gnd vol tage. the additional external components can be placed approximately as shown. fig ure 3 1 . reference pcb layout n o n p w m f b c o m p b d 9 2 2 7 f v b v c c l x g n d c v b c 2 r 3 r 2 l 1 d 1 c n o n c v c c c o u t c 3 p o w e r g n d v o u t v c c p o w e r g n d s e n s e g n d s e n s e g n d r 1
20 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f power dissipation it is shown below reducing characteristics of power dissipation to mount 114.3 mm 76.2 mm1. 57 mm t ( 1 layer ) and 114.3 mm 76.2 mm1. 6 mm t ( 4layer ) pcb . junction temperature must be designed not to exceed 150 . power dissipation estimate the following formulas show how to estimate the device power dissipation under continuous mode operations. they should not be used if the device is working in the discontinuous conduction mode. the device power dissipation includes: 1) conduction loss ? pcon = i out 2 r on vout / v cc + vf iout (vcc - vout ) / v cc 2) switching loss: psw = 6 10 - 9 vcc iout f sw 3) gate charge loss ? pgc = ( 5.78 10 - 9 + 197.6710 - 12 vcc vcc) f sw 4) quiescent current loss ? pq = 0. 4 10 - 3 vcc where: iout is the output current (a), ron is the on - resistance of the power mosfet ( ) , vout is the output voltage (v). vcc is the input voltage (v), fsw is the switching frequency (hz). therefore power dissipation of ic is the sum of above dissipation. pd = pcon + psw + pgc + pq for given tj, tj 7dmd pd where: pd is the total device power dissipation (w), ta is the ambient temperature ( c ) tj is the junction temperature ( c ), md is the thermal resistance of the package ( c ) fig ure 3 2 . power dissipation ( 114.3 mm ? 7 6.2 mm ? 1. 57 mm t 1layer / 114.3 mm ? 7 6.2 mm ? 1. 6 mm t 4layer pcb ) 4 layer 1 layer 0.633w 1.138w 0.000 0.300 0.600 0.900 1.200 1.500 0 25 50 75 100 125 150 ambient temperature:ta[
21 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f i/o e quivalen t c ircuit pin. no pin name pin equivalent circuit pin. no pin name pin equivalent circuit 1 2 3 4 vb vcc lx gnd 5 comp 6 fb 7 pwm 8 non fig ure 3 3 . i/o equivalent circuit n o n g n d v c c v b l x g n d p w m g n d f b g n d c o m p g n d
22 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f operational notes 1) about absolute maximum rating when the absolute maximum ratings of application voltage, operating temperature range, etc. was exceeded, there is possibility of deterioration and destruction. also, the short mode or open mode, etc. destruction condition cannot be assumed. when the speci al mode where absolute maximum rating is exceeded is assumed, please give consideration to the physical safety countermeasure for the fuse, etc. 2) about gnd electric potential in every state, please make the electric potential of gnd pin into the minim um electrical potential. also, include the actual excessive effect, and please do it such that the pins, excluding the gnd pin do not become the voltage below gnd. 3) about heat design consider the power dissipation (pd) in actual state of use, and please make heat design with sufficient margin. 4) about short circuit between pins and erroneous mounting when installing to set board, please be mindful of the direction of the ic, phase difference, etc. if it is not installed correctly, there is a chance tha t the ic will be destroyed. also, if a foreign object enters the middle of output, the middle of output and power supply gnd, etc., even for the case where it is shorted, there is a change of destruction. 5) about the operation inside a strong electro - ma gnetic field when using inside a strong electro - magnetic field, there is a possibility of error, so please be careful. 6 ) about checking with set boards when doing examination with the set board, during connection of capacitor to the pin that has low impe dance, there is a possibility of stress in the ic, so for every 1 process, please make sure to do electric discharge. as a countermeasure for static electricity, in the process of assembly, do grounding, and when transporting or storing please be careful. also, when doing connection to the jig in the examination process, please make sure to turn off the power supply, then connect. after that, turn off the power supply then take it off. 7 ) about common impedance for the power supply and the wire of gnd, low er the common impedance, then, as much as possible, make the ripple smaller (as much as possible make the wire thick and short, and lower the ripple from l ? c), etc., then and please consider it sufficiently. 8 ) in the application, when the mode where the vcc and each pin electrical potential becomes reversed exists, there is a possibility that the internal circuit will become damaged. for example, during cases wherein the condition when charge was given in the ex ternal capacitor, and the vcc was shorted to gnd, it is recommended to insert the bypass diode to the diode of the back current prevention in the vcc series or the middle of each pin - vcc. 9 ) about ic pin input this ic is a monolithic ic, and betwee n each element, it has p + isolation for element separation and p board. with the n layer of each element and this, the p - n junction is formed, and the parasitic element of each type is composed. for example, like the diagram below, when resistor and transi stor is connected to pin, n p n p + p + (pin a) parasitic element resistor transistor (npn) >| >| gnd n p n n p + p + (pin b) b n e c gnd n p substrate parasitic element parasitic element
23 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f ordering informatio n b d 9 2 2 7 f - e2 part number package packaging and forming specification f: sop8 e2 : embossed tape and reel marking diagram fig ure 3 5 . marking diagram sop8(top view) d 9 2 2 7 part number marking lot number 1pin mark
24 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f physical dimension , tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2 - 5001 - 1 (max 5.35 (include.burr))
25 / 25 tsz02201 - 0252aaj00010 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 8 .jun.201 6 rev.00 1 www.rohm.com tsz22111 ? 15 ? 001 b d 9227f revision history data modification point content 8 . jun . 2016 - new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9227f package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd9227f - web page

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